mcs 0402 at, mct 0603 at , mcu 0805 at, mca 1206 at - precision www.vishay.com vishay beyschlag revision: 21-feb-17 1 document number: 28785 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 precision thin film chip resistors automotive-grade mc at precision thin film chip resistors are the perfect choice for most fields of modern precision electronics where reliability and stability is of major concern. typical applications include automotive, telecommunication, indust rial, medical equipment, precision test, and measuring equipment. features ? rated dissipation p 70 up to 0.4 w for size 1206 ? aec-q200 qualified ? approved to en 140401-801 ? superior temperature cycling robustness ? advanced sulfur resistance verified according to astm b 809 ? material categorization: fo r definitions of compliance please see www.vishay.com/doc?99912 applications ? automotive ? telecommunication ? industrial equipment ? medical equipment ? note (1) please refer to application information below. technical specifications description mcs 0402 at mct 0603 at mcu 0805 at mca 1206 at imperial size 0402 0603 0805 1206 metric size code rr1005m rr1608m rr2012m rr3216m resistance range 47 ? to 221 k ? 47 ? to 511 k ? 47 ? to 1 m ? 47 ? to 1 m ? resistance tolerance 0.1 % temperature coefficient 25 ppm/k; 15 ppm/k; 10 ppm/k rated dissipation p 70 (1) 0.100 w 0.125 w 0.200 w 0.400 w operating voltage, u max. ac rms /dc 50 v 75 v 150 v 200 v permissible film temperature, ? f max. (1) 155 c operating temperature range -55 c to 155 c permissible voltage against ambient (insulation): 1 min; u ins 75 v 100 v 200 v 300 v failure rate: fit observed ? 0.1 x 10 -9 /h
mcs 0402 at, mct 0603 at , mcu 0805 at, mca 1206 at - precision www.vishay.com vishay beyschlag revision: 21-feb-17 2 document number: 28785 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 application information when the resistor dissipates power, a te mperature rise above the ambient tempera ture occurs, depend ent on the thermal resistance of the assembled resi stor together with the printed circuit board. the ra ted dissipation applie s only if the permitt ed film temperature is not exceeded. these resistors do not feature a limited lifetime when operated within the permissibl e limits. however, re sistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. note ? the presented operation modes do not refer to different types of resistors, but actually show examples of different loads, tha t lead to different film temperatures and different achievable load-life st ability (drift) of the resistance value. a suitable low therma l resistance of the circuit board assemb ly must be safeguarded in order to maintain the film temperature of the resistors within the specified limi ts. please consider the application note thermal management in surface-mounted resistor applications ( www.vishay. com/doc?28844 ) for information on the general nature of thermal resistance. maximum resistance change at rated dissipation operation mode standard power rated dissipation, p 70 mcs 0402 at 0.063 w 0.100 w mct 0603 at 0.100 w 0.125 w mcu 0805 at 0.125 w 0.200 w mca 1206 at 0.250 w 0.400 w operating temperature range -55 c to 125 c -55 c to 155 c permissible film temperature, ? f max. 125 c 155 c max. resistance change at p 70 ? for resistance range, | ? r / r | after: mcs 0402 at 47 ? to 221 k ? 47 ? to 221 k ? mct 0603 at 47 ? to 511 k ? 47 ? to 511 k ? mcu 0805 at 47 ? to 1 m ? 47 ? to 1 m ? mca 1206 at 47 ? to 1 m ? 47 ? to 1 m ? 1000 h ? 0.1 % ? 0.2 % 8000 h ? 0.2 % ? 0.4 % 225 000 h ? 0.6 % - temperature coefficient and resistance range type / size tcr tolerance resistance e-series mcs 0402 at 25 ppm/k 0.1 % 47 ? to 221 k ? e24; e192 15 ppm/k 47 ? to 100 k ? 10 ppm/k 47 ? to 10 k ? mct 0603 at 25 ppm/k 0.1 % 47 ? to 511 k ? e24; e192 15 ppm/k 47 ? to 221 k ? 10 ppm/k 47 ? to 22.1 k ? mcu 0805 at 25 ppm/k 0.1 % 47 ? to 1 m ? e24; e192 15 ppm/k 47 ? to 332 k ? 10 ppm/k 47 ? to 33.2 k ? mca 1206 at 25 ppm/k 0.1 % 47 ? to 1 m ? e24; e192 15 ppm/k 47 ? to 511 k ? 10 ppm/k 47 ? to 43.2 k ?
mcs 0402 at, mct 0603 at , mcu 0805 at, mca 1206 at - precision www.vishay.com vishay beyschlag revision: 21-feb-17 3 document number: 28785 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note ? products can be ordered us ing either the part number or product description. packaging type / size code quantity packaging style width pitch packaging dimensions mcs 0402 at e1 1000 paper tape acc. iec 60286-3, type 1a 8 mm 2 mm ? 180 mm/7" e5 5000 e0 10 000 mct 0603 at p1 1000 4 mm ? 180 mm/7" p5 5000 pw 20 000 ? 330 mm/13" mcu 0805 at p1 1000 ? 180 mm/7" p5 5000 pw 20 000 ? 330 mm/13" mca 1206 at p1 1000 ? 180 mm/7" p5 5000 part number and product description part number: mct0603md4641bpw00 type/size version tcr resistance tolerance packaging mcs0402 mct0603 mcu0805 mca1206 m = at (automotive) f = 10 ppm/k e = 15 ppm/k d = 25 ppm/k 3 digit value 1 digit multiplier multiplier 9 = *10 -1 0 = *10 0 1 = *10 1 2 = *10 2 3 = *10 3 b = 0.1 % e1 e5 e0 p1 p5 pw product description: mct 0603-25 0.1 % at pw 4k64 mct 0603 -25 0.1 % at pw 4k64 type size tcr tolerance version packaging resistance mcs mct mcu mca 0402 0603 0805 1206 10 ppm/k 15 ppm/k 25 ppm/k 0.1 % at = automotive e1 e5 e0 p1 p5 pw 4k64 = 4.64 k ? ct0603md4 m 41bpw 00 6
mcs 0402 at, mct 0603 at , mcu 0805 at, mca 1206 at - precision www.vishay.com vishay beyschlag revision: 21-feb-17 4 document number: 28785 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 description production is strictly controlled and follows an extensive set of instructions established for reproducibility. a homogeneous film of special me tal alloy is deposited on a high grade ceramic substrate (al 2 o 3 ) and conditioned to achieve the desired temperature coefficient. specially designed inner contacts are deposited on both sides. a special laser is used to achiev e the target value by smoothly cutting a meander groove in the resistive layer without damaging the ceramics. the resistor elements are covered by a unique protective coating designed for electrical, mechanical and climatic protection. the terminations receive a final pure matte tin on nickel plating. the result of the determined production is verified by an extensive testing procedure and optical inspection performed on 100 % of the indi vidual chip resistors. this includes full screening for the elimination of products with potential risk of early fi eld failures (feasible for r ? 10 ? ). only accepted products are laid directly into the paper tape in accordance with iec 60286-3 type 1a (1) . assembly the resistors are suitable fo r processing on automatic smd assembly systems. they are suitable for automatic soldering using wave, reflow or vapour phase as shown in iec 61760-1 (1) . the encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, es ters and aqueous solutions. the suitability of conformal coatings, potting compounds and their processes, if applie d, shall be qualified by appropriate means to ensure the long-term stability of the whole system. the resistors are rohs-compliant; the pure matte tin plating provides compatibility with lead (pb)-free and lead-containing soldering pr ocesses. solderability is specified for 2 years after produ ction or requalification. the permitted storage time is 20 years. the immunity of the plating against tin whisker gr owth has been proven under extensive testing. materials vishay acknowledges the following systems for the regulation of hazardous substances: ? iec 62474, material declaration for products of and for the electrotechnical industry, with the list of declarable substances given therein (2) ? the global automotive declarable substance list (gadsl) (3) ? the reach regulation (1907/2006/ec) and the related list of substances with very high concern (svhc) (4) for its supply chain the products do not contain any of the banned substances as per iec 62474, gadsl, or the svhc list, see www.vishay.com/how/leadfree . hence the products fully comply with the following directives: ? 2000/53/ec end-of-life vehicle directive (elv) and annex ii (elv ii) ? 2011/65/eu restriction of the use of hazardous substances directive (rohs) with amendment 2015/863/eu ? 2012/19/eu waste electrical and electronic equipment directive (weee) vishay pursues the elimination of conflict minerals from its supply chain, see the conflict minerals policy at www.vishay.com/doc?49037 . approvals the resistors are approved wi thin the iecq-cecc quality assessment system for electronic components to the detail specification en 140401-801 which refers to en 60115-1 , en 60115-8 and the variety of environmental test procedures of the iec 60068 (1) series. the detail specification refers to the climatic categories 55/125/56, which relates to the standa rd operation mode of this datasheet. conformity is attested by the use of the cecc logo ( ) as the mark of conformity on the package label. vishay beyschlag has achieved approval of manufacturer in accordance with iecq 03-1 . the release certificate for technology approval schedule in accordance with cecc 240001 based on iecq 03-3-1 is granted for the vishay beysc hlag manufacturing process. the resistors are qualified according to aec-q200. related products for more information about products with higher operation temperature please refer to the professional datasheet ( www.vishay.com/doc?28760 ). chip resistor arrays may be used in sensing applications or precision amplifiers where close matching between multiple resistors is necessary. please refer to the acas at - precision datasheet ( www.vishay.com/doc?28770 ). mc at precision is also available with gold termination for conductive gluing. please refer to the datasheet ( www.vishay.com/doc?28877 ). for high power and high temperature applications mcw 0406 at wide terminal thin film chip resistors offer extremely high power ratings in compact 0406 case size and extraordinary temperatu re cycling robustness. ? please refer to the datasheets for ? precision ( www.vishay.com/doc?28847 ) and ? professional ( www.vishay.com/doc?28796 ) specification. notes (1) the quoted iec standards are also released as en st andards with the same number and identical contents. (2) the iec 62474 list of declarable subs tances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474 . (3) the global automotive declarable substance list (gadsl) is ma intained by the american chemistry council and available at www.gadsl.org . (4) the svhc list is maintained by the european chemical agency (echa) and available at http://echa.europa.eu/candidate-list-table .
mcs 0402 at, mct 0603 at , mcu 0805 at, mca 1206 at - precision www.vishay.com vishay beyschlag revision: 21-feb-17 5 document number: 28785 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 functional performance derating - standard operation derating - power operation current noise a 1 in accordance with iec 60195 current noise mcs 0402 at mct 0603 at mcu 0805 at mca 1206 at 0.1 0.2 w power dissipation c 100 150 -50 50 70 ? ambient temperature amb 0 p 0.3 0 0.1 0.2 0.3 0.4 0.5 w power dissipation p c 100 150 -50 50 70 ? ambient temperature amb mcs 0402 at mct 0603 at mcu 0805 at mca 1206 at 0 resistance value current noise a 1 0.01 1 m 0.1 1 v/v r 10 100 k 10 k 1 k 10 mcs 0402 at mct 0603 at mcu 0805 at mca 1206 at 100
mcs 0402 at, mct 0603 at , mcu 0805 at, mca 1206 at - precision www.vishay.com vishay beyschlag revision: 21-feb-17 6 document number: 28785 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 tests and requirements all tests are carried out in accordance with the following specifications: en 60115-1, generic specification en 60115-8 (successor of en 140400), sectional specification en 140401-801, detail specification iec 60068-2-xx, test methods the components are appro ved under the iecq-cecc quality assessment system for electronic components. the parameters stated in the test procedures and requirements table are based on the required tests and permitted limits of en 140401-801. the table presents only the most important tests, for th e full test schedule refer to the documents listed above. however, some additional tests and a number of improvements against those minimum requirements have been included. the testing also covers most of the requirements specified by eia/eca-703 and jis-c-5201-1. the tests are carried out under standard atmospheric conditions in accordance with iec 60068-1, 4.3, whereupon the following values are applied: temperature: 15 c to 35 c relative humidity: 25 % to 75 % air pressure: 86 kpa to 106 kpa (860 mbar to 1060 mbar) a climatic category lct / uct / 56 is applied, defined by the lower category temperature (lct), the upper category temperature (uct), and the du ration of exposure in the damp heat, steady st ate test (56 days). the components are mounted for testing on printed circuit boards in accordance with en 60115-8, 2.4.2, unless otherwise specified. test procedures and requirements en 60115-1 clause iec 60068-2 (1) test method test procedure requirements permissible change ( ? r ) stability class 0.25 or better (2) stability for product types: mcs 0402 at 47 ? to 221 k ? mct 0603 at 47 ? to 511 k ? mcu 0805 at 47 ? to 1 m ? mca 1206 at 47 ? to 1 m ? 4.5 - resistance 0.1 % r 4.8 - temperature coefficient at (20 / -55 / 20) c and (20 / 155 / 20) c 25 ppm/k; 15 ppm/k; 10 ppm/k 4.25.1 - endurance at 70 c: standard operation mode u = or u = u max. ; whichever is the less severe; 1.5 h on; 0.5 h off; 70 c; 1000 h 70 c; 8000 h (0.1 % r + 0.02 ? ) (0.2 % r + 0.02 ? ) endurance at 70 c: power operation mode u = or u = u max. ; whichever is the less severe; 1.5 h on; 0.5 h off; 70 c; 1000 h 70 c; 8000 h (0.2 % r + 0.02 ? ) (0.4 % r + 0.05 ? ) 4.25.3 - endurance at upper category temperature 125 c; 1000 h 155 c; 1000 h (0.15 % r + 0.02 ? ) (0.3 % r + 0.02 ? ) 4.24 78 (cab) damp heat, steady state (40 2) c; 56 days; (93 3) % rh (0.1 % r + 0.02 ? ) 4.37 67 (cy) damp heat, steady state, accelerated standard operation mode (85 2) c (85 5) % rh u = ; u ? 0.3 x u max. ; 1000 h (0.5 % r + 0.05 ? ) p 70 x r p 70 x r 0.1 x p 70 x r
mcs 0402 at, mct 0603 at , mcu 0805 at, mca 1206 at - precision www.vishay.com vishay beyschlag revision: 21-feb-17 7 document number: 28785 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 4.23 climatic sequence: standard operation mode (0.25 % r + 0.02 ? ) 4.23.2 2 (bb) dry heat 125 c; 16 h 4.23.3 30 (db) damp heat, cyclic 55 c; 24 h; ? 90 % rh; 1 cycle 4.23.4 1 (ab) cold -55 c; 2 h 4.23.5 13 (m) low air pressure 8.5 kpa; 2 h; (25 10) c 4.23.6 30 (db) damp heat, cyclic 55 c; 24 h; ? 90 % rh; 5 cycles 4.23.7 - dc load u = ? u max. ; 1 min -1 (aa) storage at low temperature -55 c; 2 h (0.05 % r + 0.01 ? ) 4.19 14 (na) rapid change of temperature 30 min at -55 c and 30 min at 155 c; 1000 cycles (0.25 % r + 0.02 ? ) extended rapid change of temperature 30 min at -40 c; 30 min at 125 c (3) ; mcs 0402 at: 3000 cycles mct 0603 at: 2000 cycles mcu 0805 at: 1500 cycles mca 1206 at: 1000 cycles (0.25 % r + 0.05 ? ); ( ? 50 % of initial shear force) 4.13 - short time overload: standard operation mode u = 2.5 x or u = 2 u max. ; whichever is the less severe; 5 s (0.05 % r + 0.01 ? ) 4.27 - single pulse high voltage overload: standard operation mode severity no. 4: u = 10 x or u = 2 x u max. ; whichever is the less severe; 10 pulses 10 s/700 s (0.25 % r + 0.05 ?? ) 4.39 - periodic electric overload: standard operation mode u = or u = 2 x u max. whichever is the less severe; 0.1 s on; 2.5 s off; 1000 cycles (0.5 % r + 0.05 ?? ) 4.38 - electro static discharge (human body model) iec 61340-3-1 (1) ; 3 pos. + 3 neg. (equivalent to mil-std-883, method 3015) mcs 0402 at: 500 v mct 0603 at: 1000 v mcu 0805 at: 1500 v mca 1206 at: 2000 v (0.5 % r + 0.05 ?? ) test procedures and requirements en 60115-1 clause iec 60068-2 (1) test method test procedure requirements permissible change ( ? r ) stability class 0.25 or better (2) stability for product types: mcs 0402 at 47 ? to 221 k ? mct 0603 at 47 ? to 511 k ? mcu 0805 at 47 ? to 1 m ? mca 1206 at 47 ? to 1 m ? p 70 x r p 70 x r p 70 x r 15 x p 70 x r
mcs 0402 at, mct 0603 at , mcu 0805 at, mca 1206 at - precision www.vishay.com vishay beyschlag revision: 21-feb-17 8 document number: 28785 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 notes (1) the quoted iec standards are also released as en st andards with the same number and identical contents. (2) according to the detail specific ation en 140401-801 the stability cl ass applies to the category te mperatures 85 c and 125 c a nd their respective test conditions. (3) tested on a 4-layer printed circ uit board with sac micro alloy. 4.22 6 (fc) vibration endurance by sweeping; 10 hz to 2000 hz; no resonance; amplitude ? 1.5 mm or ?? 200 m/s 2 ; 7.5 h (0.05 % r + 0.01 ?? ) no visible damage 4.17 58 (td) solderability solder bath method; snpb40; non-activated flux (215 3) c; (3 0.3) s good tinning ( ? 95 % covered); no visible damage solder bath method; snag3cu0.5 or snag3.5; non-activated flux; (235 3) c; (2 0.2) s good tinning ( ?? 95 % covered); no visible damage 4.18 58 (td) resistance to soldering heat solder bath method; (260 5) c; (10 1) s (0.05 % r + 0.01 ?? ) 4.29 45 (xa) component solvent resistance isopropyl alcohol +50 c; method 2 no visible damage 4.32 21 (ue 3 ) shear (adhesion) mcs 0402 at and mct 0603 at; 9 n no visible damage mcu 0805 at and mca 1206 at; 45 n 4.33 21 (ue 1 ) substrate bending depth 2 mm, 3 times (0.05 % r + 0.01 ?? ) no visible damage; no open circuit in bent position 4.7 - voltage proof u rms = u ins ; (60 5) s no flas hover or breakdown 4.35 - flammability iec 60695-11-5 (1) , needle flame test; 10 s no burning after 30 s test procedures and requirements en 60115-1 clause iec 60068-2 (1) test method test procedure requirements permissible change ( ? r ) stability class 0.25 or better (2) stability for product types: mcs 0402 at 47 ? to 221 k ? mct 0603 at 47 ? to 511 k ? mcu 0805 at 47 ? to 1 m ? mca 1206 at 47 ? to 1 m ?
mcs 0402 at, mct 0603 at , mcu 0805 at, mca 1206 at - precision www.vishay.com vishay beyschlag revision: 21-feb-17 9 document number: 28785 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 dimensions solder pad dimensions notes ? the given solder pad dime nsions reflect the considerations for board design and assembly as outlined e.g. in standards iec 611 88-5-x (1) , or in publication ipc-7351. ? (1) the quoted iec standards are also released as en st andards with the same number and identical contents. dimensions and mass type / size h (mm) l (mm) w (mm) w t (mm) t t (mm) t b (mm) mass (mg) mcs 0402 at 0.32 0.05 1.0 0.05 0.5 0.05 > 75 % of w 0.2 + 0.1/- 0.15 0.2 0.1 0.6 mct 0603 at 0.45 + 0.1/- 0.05 1.55 0.05 0.85 0.1 > 75 % of w 0.3 + 0.15/- 0.2 0.3 + 0.15/- 0.2 1.9 mcu 0805 at 0.52 0.1 2.0 0.1 1.25 0.15 > 75 % of w 0.4 + 0.1/- 0.2 0.4 + 0.1/- 0.2 4.6 mca 1206 at 0.55 0.1 3.2 + 0.1/- 0.2 1.6 0.15 > 75 % of w 0.5 0.25 0.5 0.25 9.2 recommended solder pad dimensions type / size wave soldering reflow soldering g (mm) y (mm) x (mm) z (mm) g (mm) y (mm) x (mm) z (mm) mcs 0402 at - - - - 0.35 0.55 0.55 1.45 mct 0603 at 0.55 1.10 1.10 2.75 0.65 0.70 0.95 2.05 mcu 0805 at 0.80 1.25 1.50 3.30 0.90 0.90 1.40 2.70 mca 1206 at 1.40 1.50 1.90 4.40 1.50 1.15 1.75 3.80 t b t t l h w w t g x y z
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